bonding – TechConnect Briefs

Engineering nanoinks and photonic manufacturing for printable electronics

Hu A., University of Tennessee, US

We have developed various nanoinks, including silver nanowires, silver nanoplates, Cu-Ag core-shell nanoparticles, graphene oxide and graphene. Gram level nanoplates are successfully synthesized through a polymer controlled hydrothermal growth. Core-shell structures are synthesized through a [...]

Controlling Oxidation Reaction on Platinum by Spin Manipulation

Sison Escaño M.C., Nguyen T.Q., Nakanishi H., Kasai H., Osaka University, JP

Oxidation of metal surface is of outstanding practical importance in microelectronics, energy conversion systems and environmental devices. As an oxidation catalyst, platinum (Pt) is widely used in chemical and automotive industries. Thus far, the dissociative [...]

A Novel Method to Maintain Alignment Accuracy in Bonding Process Utilizing Resin as an Adhesive Material

Lee S.S., Kondo M., Ishibashi R., Kinoshita K., Kishida S., Tottori University, JP

In this paper we have firstly reported that a novel method to maintain alignment accuracy in wafer bonding process utilizing resin as an adhesive material. We have proposed tentatively localized bonding method with 1100 nm [...]

Effects of Ag and Pd Addition on Mechanical Property and Ion-migration Tolerance in Low Temperature Sintering Bonding Using Ag2O Paste

Hirose A., Itou T., Ogura T., Osaka University, JP

We have proposed a new bonding process using Ag2O paste composed of Ag2O particles mixed with reduction agent of triethylene glycol (TEG). Ag nanoparticles formed at around 130℃ to 160℃ through the reduction process. Such [...]

Improved Nanoreinforced Composite Material Bonds with Potential Sensing Capabilities

Starikov D., Price A., Glenn T., Attia F., Fischer M., Bokadoum M., Bensaoula A., Integrated Micro Sensors Inc., US

Dramatic increase in the bond strength of composite/adhesive interfaces of nano reinforced composite material joints and structures has been achieved using laser-assisted fabrication of Micro Column Arrays (MCA) on the surface of the two materials [...]

Metallic submicron wires and nanolawn for microelectronic packaging. Concept and first evaluation

Fiedler S., Zwanzig M., Schmidt R., Scheel W., Fraunhofer Institut Zuverlässigkeit und Mikrointegration (IZM), Berlin, DE

Starting with a brief review of submicron wire production techniques, promising applications of submicron and nano wires are discussed. Observed attractive properties of metal rod decorated metal surfaces, so called nano lawn, for low energy [...]

A Rapid Prototyping and Mass-Production Platform of Microfluidic Devices

Craig Kung P., Kung Y.L., Holcombe D., Grace R.H., Ungelenk G., Piechotka E., Seiferth W., Optotrack, Inc., US

Microfluidic chips, disposable biosensors, and micro-optical devices have been primarily manufactured from silicon- or glass-based substrates for years. This approach involves sophisticated production tools, tedious development processes, and clean-room conditions. Given today’s fierce competition in [...]

Bonding Pad with Reduced Capacity

Mats I., Tarcenco V., Select Techno-Fix Ltd, CA

The technical solutions for the Integrated Circuits (ICs) packaging remains enough conservative during microelectronics development. The ICs with active components having size of micrometers or even nanometers continue to have bonding pads area within hundreds [...]