Zwanzig M. – TechConnect Briefs

Contact-free Handling of Metallic Submicron and Nanowires for Microelectronic Packaging Applications

Fiedler S., Zwanzig M., Jäger M.S., Böttcher M., Fraunhofer Institute for Reliability and Microintegration, DE

Individual submicron particles produced by non-lithographic techniques can be attractive for future microelectronic applications. Their touchless manipulation is a necessary prerequisite to use them, since they are too small to be handled via Pick&Place. We [...]

Metallic submicron wires and nanolawn for microelectronic packaging. Concept and first evaluation

Fiedler S., Zwanzig M., Schmidt R., Scheel W., Fraunhofer Institut Zuverlässigkeit und Mikrointegration (IZM), Berlin, DE

Starting with a brief review of submicron wire production techniques, promising applications of submicron and nano wires are discussed. Observed attractive properties of metal rod decorated metal surfaces, so called nano lawn, for low energy [...]