Yang J.P. – TechConnect Briefs

Heat Conduction Analysis of Nano-tip in Thermal-assisted Data Storage via Molecular Dynamics Simulation

Liu X.J., Yang J.P., Yang Y-W, Yang J.P., Yang Y-W, Data Storage Institute, SG

The thermal characterization of nano-tip and media is a fundamental issue for the reliability of thermal-assisted writing processes in the data sotrage. In this paper, nanoscale heat transfer properties in/between nano-tip and media are analyzed [...]

Nonequilibrium molecular dynamics simulation for size effects on thermal conductivity of silicon nanostructures

Liu X.J., Yang J.P., Yang Y-W, Yang J.P., Yang Y-W, Nanyang Technological University, SG

The thermal conductivity of silicon nanostructures was investigated using the Tersoff potential based Nonequilibrium molecular dynamics (NEMD) simulation approach. In such bond-order NEMD simulation model, the quality of the Tersoff potential for heat transport of [...]

Effects of Slider-Driven Piezo-Microactuator Placements and Profiles on HGA Sway Mode

Yang J.P., Chen S.X., National University of Singapore, US

With areal recording density of hard disk drives (HDD) historically growing at an average of 60% per year, it is becoming increasingly more difficult to maintain the precise positioning required of the ever-smaller GMR heads [...]