Xie H. – TechConnect Briefs

Analysis and Simulation of Curved Bimorph Microactuators

Pal S., Xie H., University of Florida, US

Difference in strains in the two layers of a bimorph causes it to curl, thereby leading to actuation. Thermal, piezoelectric and shape-memory alloy based straight bimorph actuators have been widely reported. However, little attention has [...]

Dynamic Compact Thermal Model of an Electrothermal Micromirror Based on Transmission Line Theory

Pal S., Xie H., University of Florida, US

The two main challenges in electrothermal MEMS design are their slow response and inherently low efficiency. Therefore, thermal modeling is essential for design and optimization. A compact parametric model is desirable as it computationally efficient [...]

Radiolabeling of Nanoshells with Cu-64 and In-111 for PET and SPECT Imaging in Rats

Xie H., Wang Z., Bao A., Goins B., Phillips W.T., Coleman C.L., Texas Southern University, US

Here we report for the first time the radioactive labeling of gold-silica nanoshells with Cu-64 and In-111. A bifunctional polyethylene glycol (PEG2000) is used as crosslinker to connect nanoshells with DOTA or DTPA, which are [...]

Design and Microfabrication of an Electrostatically Actuated Scanning Micromirror with Elevated Electrodes

Haris M., Qu H., Jain A., Xie H., Oakland University, US

This paper reports the design and microfabrication of an electrostatically actuated CMOS-MEMS micromirror with elevated electrodes. Device structural design and fabrication process are detailed and device performance such as scanning angles is simulated using CoventorWare. [...]

Characterization of An Integrated 3-Axis CMOS-MEMS Accelerometer

Qu H., Fang D., Xie H., Oakland University, US

This paper reports an integrated 3-axis CMOS-MEMS accelerometer with single proof mass. Sensor design, fabrication process are introduced and detailed characterization of this small-sized accelerometer is addressed. Compared to the previously reported 3-axis accelerometers, most [...]

Design and fabrication of an integrated CMOS-MEMS 3-axis accelerometer

Xie H., Fedder G.K., Pan Z., Frey W., University of Florida, US

This paper reports a novel single structure, three-axis sensing accelerometer based on post-CMOS process. The resultant device incorporates both thin-film structures and bulk Si structures to achieve three-axis acceleration sensing without extra front-side lithography, or [...]

Design and fabrication of an integrated CMOS-MEMS 3-axis accelerometer

Xie H., Fedder G.K., Pan Z., Frey W., University of Florida, US

This paper reports a novel single structure, three-axis sensing accelerometer based on post-CMOS process. The resultant device incorporates both thin-film structures and bulk Si structures to achieve three-axis acceleration sensing without extra front-side lithography, or [...]

Simulation and Characterization of a CMOS Z-axis Microactuator with Electrostatic Comb Drives

Xie H., Erdman L., Jing Q., Fedder G.K., Carnegie Mellon University, US

This paper reports the first design and its simulation and experimental results of a CMOS z-axis microactuator that utilizes the vertical electrostatic forces existing between multi-conductor comb fingers. The measured maximum displacement of the z-axis [...]