Won P.M. Nieva S.-H.P. – TechConnect Briefs

Residual Stress Dependency on Wafer Location of Thin Film PECVD Silicon Nitride

Godin J.R., Won P.M. Nieva S.-H.P., Phong L.N., University of Waterloo, CA

The residual stress of use plasma enhanced chemical vapor deposition (PECVD) silicon nitride has been investigated in the past. The majority of these studies utilize bulk stress measurements through wafer curvature, assuming that the residual [...]