Vogel D. – TechConnect Briefs

Nanoscale Resolution Deformation Measurements at Crack Tips of Nanostructured Materials and Interface Cracks

Keller J., Vogel D., Gollhardt A., Michel B., Fraunhofer Institute for Reliability and Microintegration, DE

The trend towards the application of nanoparticle filled materials in the aerospace and automotive electronics sectors have led to a strong need in material characterization on the micro and nano scale. In addition MEMS and [...]

Residual Stress Measurements of High Spatial Resolution

Vogel D., Luczak F., Michel B., Fraunhofer Institute for Reliability and Microintegration, DE

Residual stresses in semiconductor and MEMS devices superposing functional and environmental loading are one of the crucial reliability issues as they can add significant stress levels leading finally to component damage. Most of routinely used [...]

Nanoscale Deformation Measurements for Reliability Assessment of MEMS and NEMS

Keller J., Vogel D., Michel B., Fraunhofer Institute for Reliability and Microintegration (IZM), DE

Recent advances in microtechnology and the development of new electronics and micro/nanosystem devices in automotive industry, communication sector and life science have led to a strong need in material characterization on the micro and nano [...]

NanoDAC/fibDAC – Nanodeformation Measurement Techniques for Reliability Analysis of MEMS and NEMS

Keller J., Vogel D., Michel B., Fraunhofer Institute for Reliability and Microintegration (IZM), DE

Recent advances in microtechnology and the development of new electronics and micro/nanosystem devices in automotive industry, communication sector and life science have led to a strong need in material characterization on the micro and nano [...]