A New Method to Design Pressure Sensor Diaphragm
Wang X., Li B., Lee S., Sun Y., Roman H.T., Chin K., Farmer K.R., New Jersey Institute of Technology, US
Over the last decade, silicon pressure sensors have undergone a significant growth. In most cases, these MEMS (Microelectromechanical System) devices are manufactured from rectangular or circular diaphragms whose thickness is constant and in the order [...]