Ostergaard D. – TechConnect Briefs

New Accurate 3-D Finite Element Technology for Solving Geometrically Complex Coupled-Field Problems

Avdeev I., Gyimesi M., Lovell M., Ostergaard D., University of Pittsburgh, US

Increased functionality of microelectromechanical systems (MEMS) has lead to the development of micro-scale devices that are geometrically complex. These complex configurations require the development of new and more efficient finite element (FE) techniques for modeling [...]

Triangle Transducer for Micro Electro Mechanical Systems (MEMS) Simulation in ANSYS Finite Element Program

Gyimesi M., Ostergaard D., Avdeev I., ANSYS, Inc., US

The paper introduces a new methodology with a distributed triangle transducer for the strongly coupled simulation of micro electro mechanical systems (MEMS) in ANSYS Finite Element (FE) program.

Electro-Mechanical Transducer for MEMS Analysis in ANSYS

Gyimesi M., Ostergaard D., ANSYS, Inc., US

The paper introduces an electro-mechanical transducer finite element (EMT) for the strongly coupled simulation of micro electro-mechanical system (MEMS) devices in the commercial finite element analysis (FEA) package ANSYS.