Fabrication of Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process and Anodic Bonding
This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. The silicon through-wafer interconnects have been investigated by glass reflow process. Then, [...]