Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics
Sieiro J., Morrissey A., Carmona M., Marco S., Samitier J., Alderman J., Universitat de Barcelona, ES
This paper descubes the thermal behaviour of vertical multichip module (V-MCM) devised within the BARMINT Esprit Project. It encloses an stack of elements including several ICs. a micromachined pump, and a multisensor chip provided with [...]