Michel B. – Page 2 – TechConnect Briefs

Nanoscale Deformation Measurements – Concepts for Failure and Reliability Assessment at the Nanoscale

Michel B., Gollhardt A., Keller J., Fraunhofer Institute for Reliability and Microintegration, DE

The paper presents two methods for deformation measurement at the nanoscale level. The first method is based on Scanning Probe Microscopy (SPM) in combination with Digital Image Correlation (DIC). The technique serves as the basis [...]

Residual Stress Measurements of High Spatial Resolution

Vogel D., Luczak F., Michel B., Fraunhofer Institute for Reliability and Microintegration, DE

Residual stresses in semiconductor and MEMS devices superposing functional and environmental loading are one of the crucial reliability issues as they can add significant stress levels leading finally to component damage. Most of routinely used [...]

Nanoscale Deformation Measurements for Reliability Assessment of MEMS and NEMS

Keller J., Vogel D., Michel B., Fraunhofer Institute for Reliability and Microintegration (IZM), DE

Recent advances in microtechnology and the development of new electronics and micro/nanosystem devices in automotive industry, communication sector and life science have led to a strong need in material characterization on the micro and nano [...]

NanoDAC/fibDAC – Nanodeformation Measurement Techniques for Reliability Analysis of MEMS and NEMS

Keller J., Vogel D., Michel B., Fraunhofer Institute for Reliability and Microintegration (IZM), DE

Recent advances in microtechnology and the development of new electronics and micro/nanosystem devices in automotive industry, communication sector and life science have led to a strong need in material characterization on the micro and nano [...]