Liu X.J. – TechConnect Briefs

Heat Conduction Analysis of Nano-tip in Thermal-assisted Data Storage via Molecular Dynamics Simulation

Liu X.J., Yang J.P., Yang Y-W, Yang J.P., Yang Y-W, Data Storage Institute, SG

The thermal characterization of nano-tip and media is a fundamental issue for the reliability of thermal-assisted writing processes in the data sotrage. In this paper, nanoscale heat transfer properties in/between nano-tip and media are analyzed [...]

Nonequilibrium molecular dynamics simulation for size effects on thermal conductivity of silicon nanostructures

Liu X.J., Yang J.P., Yang Y-W, Yang J.P., Yang Y-W, Nanyang Technological University, SG

The thermal conductivity of silicon nanostructures was investigated using the Tersoff potential based Nonequilibrium molecular dynamics (NEMD) simulation approach. In such bond-order NEMD simulation model, the quality of the Tersoff potential for heat transport of [...]