Lin J.Y. – TechConnect Briefs

A New Copper Electrodeposition Scheme to Reduce Void Defects after Chemical Mechanical Polishing

Lin J.Y., Wang Y.Y., Wan C.C., Wang Y.Y., National Tsing Hua University, TW

Deposition of highly (111) oriented conductive layer is required for achieving better electromigration resistance and lower resistivity. Moreover, the amount of void defects decreases as the (111)/(200) ratio increases in CMP process. Hence, we investigated [...]