Li H.C. – TechConnect Briefs

Packaging Design with Thermal Analysis of LED on Silicon Substrate

Tsou C., Huang Y.S., Li H.C., Lai T.S., Feng Chia University, TW

In this paper, we demonstrate a package method for a package component of LED (Light Emitting Diode) using state of the art MEMS technologies and careful materials selection such as using a silicon substrate to [...]

The Design and Simulation of a Novel Out-of-plane Micro Electrostatic Actuator

Tsou C., Huang S.L., Lai T.S., Li H.C., Feng Chia University, TW

This paper presents a mechanism of developing a novel out-of-plane micro electrostatic actuator capable of causing large out-of-plane deflection. The proposed actuation mechanism is using the attraction force between the charged bodies to bend the [...]