Lakdawala H. – TechConnect Briefs

Macromodeling Temperature-Dependent Curl in CMOS Micromachined Beams

Iyer S., Lakdawala H., Fedder G.K., Mukherjee T., Carnegie Mellon University, US

Temperature sensitive curling is commonly observed in MEMS structures fabricated using a standard CMOS pro-cess. In this paper, a macromodel for vertical and lateral curling effects is derived by extending thermal multimorph theory for cantilever [...]

Intelligent Automatic Meshing of Multilayer CMOS Micromachined Structures for Finite Element Analysis

Lakdawala H., Baidya B., Mukherjee T., Fedder G.K., Carnegie Mellon University, US

In this paper, we describe an automatic technique for meshing multilayer CMOS micromachined structure for Finite Element Analysis (FEA) from device layout. The technique is based on a 3D canonical representation of the different CMOS [...]