Kumar D. – TechConnect Briefs

Experimental study on sheet resistivity and thickness measurement in Copper Electroplating

Sharma A., Kumar D., Kumar Khandelwal S., Bansal D., Rangra K., Kumar D., Kumar Khandelwal S., Central Electronics Engineering Research Institute (CEERI/ CSIR), IN

Electroplated copper thin films have been extensively used for interconnections in semiconductor devices. In this paper, electroplating of copper has been investigated to study the dependency of plated film thickness, current efficiency and sheet resistivity [...]

Fabrication and analysis of MEMS test structures for residual stress measurement

Sharma A., Kaur M., Bansal D., Kumar D., Rangra K., Central Electronics Engineering Research Institute (CEERI/ CSIR), IN

A set of microstructures for in situ stress measurement is presented. It is based on lancet principle, with dedicated design for the amplification of the dimensional variations induced by the internal stress of the structural [...]