Keller J. – TechConnect Briefs

Nanoscale deformation analysis for fracture mechanical evaluation of interface cracks in electronic packages

Keller J., Schulz M., Mrossko R., Wunderle B., Michel B., AMIC Angwandte Micro-Messtechnik GmbH, DE

The ongoing development of highly integrated electronic packages leads to a steadily increasing number of material interfaces within a package. In combination with increasing harshness (vibration, humidity, temperature) of the system environment the reliability of [...]

Fracture mechanical test methods for interface crack evaluation of electronic packages

Keller J., Maus I., Pape H., Wunderle B., Michel B., AMIC Angewandte Micro-Messtechnik GmbH, DE

The ongoing development of highly integrated electronic packages leads to a steadily increasing number of material interfaces within a package. In combination with increasing harshness (vibration, humidity, temperature) of the system environment the reliability of [...]

Advanced Virtual Qualification Methods to Reduce the Time-to-Market of Microelectronic Assemblies

Shirangi M.H., Koyuncu M., Keller J., Michel B., Bosch Mahle TS GmbH, DE

This work presents some recent progresses in reliability assessment of electronic assemblies in automotive industry and shows how coupled numerical-experimental techniques can help saving time and reducing the cost of IC package qualification. In order [...]

Authors: Keller J.

Nanoscale deformation analysis for fracture mechanical evaluation of interface cracks in electronic packages

Fracture mechanical test methods for interface crack evaluation of electronic packages

Advanced Virtual Qualification Methods to Reduce the Time-to-Market of Microelectronic Assemblies

Nanoscale Resolution Deformation Measurements at Crack Tips of Nanostructured Materials and Interface Cracks

Nanoscale Deformation Measurements – Concepts for Failure and Reliability Assessment at the Nanoscale

Nanoscale Deformation Measurements for Reliability Assessment of MEMS and NEMS

NanoDAC/fibDAC – Nanodeformation Measurement Techniques for Reliability Analysis of MEMS and NEMS