Hong S-J – TechConnect Briefs

Synthesis of thermal interface material with high thermal conductivity for high efficacy of LED

Han C.J., Han J.-I., Yu S.H., Hong S-J, Kim Y-S, Han C.J., Han J.-I., Korean Electronics Technology Institute, KR

Thermal dissipation problem for LED is critical for high efficacy and reliability. Inorganic filled grease type thermal interface material (TIM) has widespread use for heat management of LED. Conventional TIM materials, however, has relative low [...]

Synthesis of thermal interface material with high thermal conductivity for high efficacy of LED

Han C.J., Han J.-I., Yu S.H., Hong S-J, Kim Y-S, Han C.J., Han J.-I., Korean Electronics Technology Institute, KR

Thermal dissipation problem for LED is critical for high efficacy and reliability. Inorganic filled grease type thermal interface material (TIM) has widespread use for heat management of LED. Conventional TIM materials, however, has relative low [...]

Plasma Manufacturing of Near-Net-Shape Large Scale Nanocomposite Structures – A Potential Bulk Nanofabrication Tool

Georgieva P., Viswanathan V., Hong S-J, Rea K., Seal S., University of Central Florida, AMPAC, US

In this presentation we report, for the first time, the successfully fabrication of a near-net shape bulk nanocomponent using plasma spray forming. In the research toward development of a component with retained nanostructure, enhanced oxidation [...]

Direct Electrochemical Reduction of CuO Nano Particles to Cu Nano Particles in NaCl Solution

Hwang G-H, Han W-K, Hong S-J, Choi J.W., Kang S-G, Hanyang University, KR

Copper nanoparticles are widely used material. However many reactive metals are difficult to produce without complex and expensive procedures. For low cost and mass production, the electrochemical reduction is a convenient technique to manufacture metal [...]