Using Nanoparticles and Carbon Nanotubes to Enhance the Properties of a Lead-free Solder
Nai S.M.L., Han Y.D., Jing H.Y., Tan C.M., Wei J., Gupta M., Singapore Institute of Manufacturing Technology, SG
Solders are used in various levels of electronic assembly sequence, whereby good electrical, thermal and mechanical performances of solder are necessary. With miniaturization of devices, diverse functional requirements and ever-stricter operating environments of devices, the [...]