New Designs for MEMS-Micromirrors and Micromirror Packaging with Electrostatic and Piezoelectric Drive
Gu-Stoppel S., Stenchly V., Kaden D., Quenzer H.-J., Wagner B., Hofmann U., Dudde R., Fraunhofer Institute Silicon Technology, DE
New devices of 1 and 2dimensional micro-mirrors based on new designs and new process capabilities using piezoelectric actuators are presented. For micro-mirrors an 8’’ wafer-level packaging process was developed using pre-processed borosilicate glass wafers. An [...]