Feng H.P. – TechConnect Briefs

Investigation of the Behaviors of Various Electroplated Copper films during CMP

Feng H.P., Cheng M.Y., Wang Y.Y., Wan C.C., Wang Y.Y., National Tsing Hua University, TW

The behaviors of various electroplated copper films during CMP are important for removal mechanism and defect generation. This article was to study the characteristics of various copper films during CMP, including impurity effect and current [...]