Chen J. – TechConnect Briefs

Mass Production of Metal Oxide Nanoparticle Dispersion for Heat-ray Shielding Application

Shen Z., Soh W., Zhang J., Wang A., Chen J., Chen W., Yun J., Sher D., Chen J., Chen W., NanoMaterials Technology Pte Ltd, SG

A unified approach, HGCP process was applied to produce various metal oxide nanoparticle dispersion with low cost. The process involved achieving instantaneous molecular mixing for metal salts and precipitant reactants by using HGCP reactor to [...]

SC-15 Epoxy Reinforced with Magnetic Nanofillers under Uniform Magnetic Field – An Investigation of Anisotropic Physical Properties

Malkina O., Mahfuz H., Sorge K.D., Rondinone A.J., Chen J., Rangari V.K., Florida Atlantic University, US

SC-15 epoxy is used in many industrial applications. It is well known that the mechanical and viscoelastic properties of epoxy can be significantly enhanced when reinforced with nanofillers. In this work, SC-15 epoxy is reinforced [...]

Sustainable production of 1,2-propanediol: Clean hydrogenolysis of glycerol over highly stable Cu-Ce/SiO2 nanocatalyst

Huang Z., Cui F., Chen J., Xia C., Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, CN

Large quantities of glycerol are available as a reaction coproduct owing to the rapid development of biodiesel production by transesterification of vegetable oils and animal fats. The hydrogenolysis of glycerol to propanediols is one process [...]

Investigating electrospun nanofibrous scaffold mechanical properties

Farboodmanesh S., Chen J., Pelealuw J.L., Cloutier D.E., University of Massachusetts-Lowell, US

There has been a considerable growth and development in electrospun nanofibers for research activity, as well as commercial fabrication over the past couple of decades. These continuous nanofibers are solution driven exclusively by an electric [...]

Fabrication and Characterization of Nanoscale Heating Sources (“Nanoheaters”) for Nanomanufacturing

Jogdand H., Gulsoy G., Ando T., Chen J., Doumanidis C.C., Gu Z., Gulsoy G., Rebholz C., Wong P., University of Massachusetts-Lowell, US

In macroscale manufacturing, active use of heat to alter the geometry, structure and properties of solids is central to material removal, deposition, joining, shaping, and transformation processes. However, traditional heat sources encroach difficulties with fine [...]

Differential Cytotoxicity of Metal Oxide Nanoparticles

Chen J., Zhu J., Cho H.-H., Cui K., Li F., Zhou X., Rogers J.T., Wong S.T.C., Huang X., Brigham and Women's Hospital, Harvard Medical School, US

There are growing concerns among the general public and regulators about their potential health hazard. To determine the potentially toxic responses of CNS due to exposure of metal oxide nanoparticles, human SH-SY5Y neuroblastoma and H4 [...]

A Circuit-Compatible Model for Ballistic Silicon Nanowire Transistors

Chen J., Agere Systems, US

Silicon nanowire transistors (SNWT) are being extensively explored as a successor to CMOS. Silicon nanowires with a diameter as small as 2nm and having high carrier mobility have been achieved. Such developments shed light on [...]

Compact Modeling of Spiral Inductors for RF Applications

Chen J., Liou J.J., University of Central Florida, US

Recent growth in RF applications has increased the use of spiral inductors and thus demanded a more accurate model for such devices. In this paper, we develop a compact model for spiral inductors with symmetrical [...]

Noncovalent Engineering of Carbon Nanotube Surfaces

Chen J., Ramasubramaniam R., Liu H., Zyvex Corporation, US

Single-walled carbon nanotubes (SWNTs), due to their novel structural, thermal, electrical, mechanical and optical properties, are expected to find applications in many fields. Pristine SWNTs are generally insoluble in common solvents, and difficult to functionalize [...]

Development of a MEMS Vertical Planar Coil Inductor

Chen J., Zou J., Liu C., Kang S-M, Agere Systems, US

This paper presents the results of the development of a vertical planar coil inductor. The planar coil inductor is first fabricated on silicon substrate and then assembled to the vertical position by using a novel [...]