CarrICool – the Innovative 3D Interposer Platform for HPC Systems: Analysis, Simulations, Optimization, Practice for Reliability Improvement and Performance Increase
This paper presents specific solutions being developed in frame of the CarrICool (abbr. “Modular Interposer System Architecture providing scalable Heat Removal, Power Delivery and Optical Signaling”) European FP7 project. The presented research and developed solutions [...]