University of Wolverhampton – TechConnect Briefs

Effect of IMC thickness on thermo-mechanical reliability of lead-free solder joints in solar cell assembly

Zarmai M.T., Ekere N.N., Oduoza C.F., Amalu E.H., University of Wolverhampton, UK

The fatigue failure of lead-free SnAgCu solder joints in solar cell assembly is studied to determine the effect of thickness of intermetallic compound (IMC) layer on the reliability of the joints. Finite element modelling (FEM) [...]

Evaluation of Garofalo creep model for lead-free solder joints in surface mount components

Amalu E., University of Wolverhampton, UK

This investigation employs four hyperbolic sine creep constitutive models to simulate the deformation in Sn[3.0-4.0%]Ag[0.5-1.0%]Cu solder joints of two surface mount components assembled on printed circuit board. These creep models are proposed by Schubert et [...]