POSTECH – TechConnect Briefs

MD Simulations on the Momentum Transfer to Nano Contaminant Particle on Wafer Surface in Collisions with Cleaning Bullets

This study aims to clarify the basic mechanism through MD simulations on momentum transfer during collisions between target contaminant and cleaning bullet particles both in the nanometer size range. Even in conditions where the contaminant [...]

Simultaneous removal of nano-sized contaminant particles with multi-modal size distribution using hybrid particle beams

Kim I., Lee J.W., POSTECH, KR

The removal of contaminant particles(CPs) as small as 10nm from wafer surface is essential in successful fabrication of nano-scale devices. The supersonic particle beam technique using nano-sized volatile bullet particles(BPs) was extremely effective in removing [...]

Removal of 10-nm contaminant particles from a wafer surface with supersonic CO2 particle beam

Kim E-J, Kim I-H, Kim E-J, Kim I-H, Lee J.W., POSTECH, KR

Contaminant control is becoming a major issue of nano-scale devices. Cryogenic aerosol beam using micron-sized aerosol particles has long been successfully used to remove contaminant particles (CPs) down to 50nm, and supersonic particle beam using [...]

Cleaning 10nm ceramic particles by the supersonic particle beam

Kim I., Hwang K., Lee J.W., POSTECH, KR

Cryogenic aerosol beam using micron-sized aerosol particles has long been successfully used to remove contaminant particles down to 50nm, and supersonic particle beam using particles smaller than 100nm lowered the limit of cleaning down to [...]

Replication of micro/nano combined structure using micro/nano combined aluminum stamp

Cha K.J., Kwon T.H., POSTECH, KR

This paper presents an easy and efficient fabrication method of plastic replicas of micro/nano combined structures using an aluminum stamp with micro/nano combined structures (ASMNCS) on its surface. ASMNCS could be fabricated by two steps: [...]