Microsystem Technology Common Laboratory

The Bonding Technology for Microchannels with Electrode Patterns on the Glass Substrates

Parng S.H., Yang H.J., Shia T.K., Microsystem Technology Common Laboratory, TW

Objectives: Bonding surface preparation, process conditions, and integrated on-chip metal sheet resistance variation during bonding process were investigated in this work. Methods: We flatten the surface of the etched micro-channels with a fresh solution of [...]

DNA Extraction with Parallel Electrodes on Microfluidic System

Parng S.H., Shia T.K., Yang H.J., Kuo C.H., Microsystem Technology Common Laboratory, TW

DNA trapping was demonstrated between an electrical field across two parallel integrated electrodes on chip fabricated by the MEMS techniques. The method to release the trapped DNA molecules using reversed voltage control electrical field was [...]