TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeAffiliationsJapan Atomic Energy Agency

Affiliations: Japan Atomic Energy Agency

Study on Sodium Nanofluid for Fast Reactor (2)Reaction Suppression of Sodium Nanofluid

Nagai K., Saito J., Ara K., Japan Atomic Energy Agency, JP
  Liquid sodium is used for a coolant of fast reactor, because of its superior thermal properties and high melting temperature etc. However liquid sodium has high chemical reactivity with oxygen or water. This is the [...]

Study on Sodium Nanofluid for Fast Reactor (1)Concept of Sodium Nanofluid

Saito J.-I., Nagai K., Ara K., Japan Atomic Energy Agency, JP
Liquid sodium is used for a coolant of fast reactor (FR), because it has superior properties. For example, there are high heat conductivity, high melting temperature and excellent compatibility with structural materials. However high reactivity [...]

The concept of a superconductor of man-made 1D superlattice

Inoue A., Japan Atomic Energy Agency, JP
It is well-known that man-made 1D superlattice structure (for instance, GaAs-Ga1-xAlxAs prepared with alternating epitaxy) exhibits a resonant tunneling phenomenon. The mean free path of an electron is, however limited to the order of 100 [...]

The interpretation of the conventional superconductivity on the basis of hypothesis of small polaron

Inoue A., Japan Atomic Energy Agency, JP
The mechanism of conventional superconductivity is well-known to be able to be explained on the basis of BCS theory which is based on the ambiguous correlation between a normal state and superconductive state of metals. [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.