Fraunhofer Institute for Reliability and Microintegration

Contact-free Handling of Metallic Submicron and Nanowires for Microelectronic Packaging Applications

Fiedler S., Zwanzig M., Jäger M.S., Böttcher M., Fraunhofer Institute for Reliability and Microintegration, DE

Individual submicron particles produced by non-lithographic techniques can be attractive for future microelectronic applications. Their touchless manipulation is a necessary prerequisite to use them, since they are too small to be handled via Pick&Place. We [...]

Nanoscale Resolution Deformation Measurements at Crack Tips of Nanostructured Materials and Interface Cracks

Keller J., Vogel D., Gollhardt A., Michel B., Fraunhofer Institute for Reliability and Microintegration, DE

The trend towards the application of nanoparticle filled materials in the aerospace and automotive electronics sectors have led to a strong need in material characterization on the micro and nano scale. In addition MEMS and [...]

Nanoscale Deformation Measurements – Concepts for Failure and Reliability Assessment at the Nanoscale

Michel B., Gollhardt A., Keller J., Fraunhofer Institute for Reliability and Microintegration, DE

The paper presents two methods for deformation measurement at the nanoscale level. The first method is based on Scanning Probe Microscopy (SPM) in combination with Digital Image Correlation (DIC). The technique serves as the basis [...]

Residual Stress Measurements of High Spatial Resolution

Vogel D., Luczak F., Michel B., Fraunhofer Institute for Reliability and Microintegration, DE

Residual stresses in semiconductor and MEMS devices superposing functional and environmental loading are one of the crucial reliability issues as they can add significant stress levels leading finally to component damage. Most of routinely used [...]