Feng Chia University – TechConnect Briefs

Multiple surfaces pretreatments of nanoporous SiO2-based dielectric layers for electroless plating of copper

Chen G.S., Feng Chia University, TW

In this work, Black Diamond II (DB II with a chemical formula of SiOC:H), a leading nanoporous chemically vapor deposited dielectric layer, is examined as a test case for the SiO2-derived nanoporous IMDs, demonstrating the [...]

The Application of Ansperical Microlens Array on Direct Backlight System

Tsou C., Lai T., Huang C., Chang C., Wu C., Feng Chia University, TW

Today’s liquid crystal displays (LCDs) have to achieve more brightness and better uniformity in a thinner package, especially for the large-sized LCD panels with direct-type LED backlight system. Different reflective and transmissive characteristics managed by [...]

Packaging Design with Thermal Analysis of LED on Silicon Substrate

Tsou C., Huang Y.S., Li H.C., Lai T.S., Feng Chia University, TW

In this paper, we demonstrate a package method for a package component of LED (Light Emitting Diode) using state of the art MEMS technologies and careful materials selection such as using a silicon substrate to [...]

The Design and Simulation of a Novel Out-of-plane Micro Electrostatic Actuator

Tsou C., Huang S.L., Lai T.S., Li H.C., Feng Chia University, TW

This paper presents a mechanism of developing a novel out-of-plane micro electrostatic actuator capable of causing large out-of-plane deflection. The proposed actuation mechanism is using the attraction force between the charged bodies to bend the [...]