Analog Devices – TechConnect Briefs

Fabrication & Integration of nanobolometer sensors on a MEMs process

Gilmartin S.F., Arshak A., Arshak K., Collins D., Bain D., Lane W.A., Korostynska O., Arshak A., Arshak K., McCarthy B., Newcomb S.B., Analog Devices, IE

In this paper, we report the fabrication of novel nanoscale bolometer sensor devices using conventional titanium and titanium-nitride metal films, with total bolometer film thicknesses ranging from 60-150nm. The bolometer devices we present are integrated [...]

Fabricating Nanoscale Features Using the 2-Step NERIME TSI Nanolithography Process

Gilmartin S.F., Arshak A., Arshak K., Collins D., Korostynska O., Arshak A., Arshak K., Analog Devices, IE

The 2-step negative resist image by dry etching (2-step NERIME) focused ion beam (FIB) top surface imaging (TSI) process is a novel nanolithography technique for creating nanometer scale resist features using conventional DNQ/novolak resists. The [...]

Development of an FET Pressure Sensor Model and used to Predict Sensor Behaviour as a Function of Electrode Geometry

Hynes E., Elebert P., O'Neill M., Berney H., Lane W.A., Kelly G., Hill M., Analog Devices, IR

This paper presents the development and solution of a model to describe the behaviour of a surface micromachined FET pressure sensor. Initially an expression is developed to describe the radial deflection of the sensing diaphragm [...]