Papers:
Computational Modeling of a Wearable Device with Feedback to Advance the Healing of Chronic Skin Ulcers
This paper discusses how COMSOL Multiphysics modeling software allows for design ideas to be validated through computer simulation. The simulations generated show the Organic Electrochemical Field Effect Transistor (OECT) with a Poly(imide) (PI) polymer microfluidic [...]
Development, Manufacturing, and Application of Photoacoustic Test Phantom
Photoacoustic (PA) research is an up and coming field that is being applied to the medical space. PA combines the use of both optics and acoustics to create a final outputted signal (Figure 1). The [...]
The use of RFID technology in university classrooms: Covid-19 related
COVID-19 is a pandemic that has put countries in a global crisis. In the United states over 78 Million people are infected, and more than 900 thousand deaths are reported as on February 18, 2022. [...]
Adhesive Offering Z-Axis Conductivity, Stretchability and Manufacturing Scalability for LED Electroactive Light Sheets
Stemmermann A., Stemmermann M., Balder D., Stemmermann A., Stemmermann M., Lall P., SunRay Scientific LLC, US
New product demands call for new solutions. Globally, the electrically conductive adhesives market has seen more than 40 new product launches in the last three years. Clearly certain needs are as yet unmet. Among those [...]
Delocalized Electron Relay in Superconductive Multiple-layer Self-Assembled Membranes Promoted Room-temperature d Wave Mixed-spin Triplet of Copper-pair to Penetrate Toroidal Josephson Junction Barriers with a Magnitude Higher Open Circuit Potential
A room temperature superconductive/mem-element device is developed, and it comprises (1) superconductive - insulator-superconductive (SIS) structure, (2) immobilized zinc ions in the self-assembled membrane (SAM) promoted d wave mixed-spin triplet bounding enhanced curvature nanotubes formations [...]
Journal: TechConnect Briefs
Volume: TechConnect Briefs 2022
Published: June 13, 2022
Industry sector: Sensors, MEMS, Electronics
Topics: Informatics, Modeling & Simulation, Modeling & Simulation of Microsystems
ISBN: 979-8-218-00238-1