Informatics, Electronics and Microsystems: TechConnect Briefs 2017

Chapters:

1. Informatics, Modeling & Simulation
2. Nanoelectronics
3. MEMS & NEMS Devices, Modeling & Applications
4. Inkjet Design, Materials & Fabrication
5. 3D Printing
6. Printed & Flexible Electronics
7. Photonic Materials & Devices

Journal: TechConnect Briefs
Volume: 4, Informatics, Electronics and Microsystems: TechConnect Briefs 2017
Published: May 14, 2017
ISBN: 978-0-9988782-1-8