Chen J., Liu L., Li Z., Liu L.
Tsinghua University, CN
Keywords: capacitor, corrugation, couple-field analysis, diaphragm, FEA
Novel single-chip fabricated condenser structures with corrugated diaphragms for residual stress releasing have been proposed and simulated. An electrostatic-structural coupling FEM analysis has been performed to fully reveal the nonlinear relationship of output electrical signal with respect to input mechanical change. The influence of various nonlinear effects on the performance of transducers is investigated. Two typical corrugation layouts are studied. Numerical results have shown that the round structure was promising with its potential of high sensitivity, while the squared one was superior in the low-voltage applications. The ill effects of these variations can be reduced by delicate design and adjusting of corresponding processes.
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems
Published: April 22, 2002
Pages: 238 - 241
Industry sector: Sensors, MEMS, Electronics
Topic: MEMS & NEMS Devices, Modeling & Applications
ISBN: 0-9708275-7-1