Papers – Page 39 – TechConnect Briefs

Embeddable Low-Voltage Micropump using Electroosmosis of the Second Kind

Heldal T., Volden T., Auerswald J., Knapp H., IQ Micro Inc., CH

A low-voltage micropump with no moving parts and based on standard MEMS fabrication techniques has been developed. High pumping rate is achieved by using electroosmosis of the second kind (EO2). The pump has been characterized [...]

Nanodroplet Impact on Liquid Substrates via Molecular Dynamics

Lussier D., Kakalis N.M.P., Ventikos Y., University of Oxford, UK

In this paper, several aspects of the dynamic behaviour of liquid nanodroplets impacting on liquid substrates are investigated using molecular dynamics (MD) simulations. We consider liquid droplets of 5-10 nm in diameter, consisting of 7,000 [...]

Fabrication of 1D nanochannels with thin glass wafers for single molecule studies

Hoang H., Segers-Nolten I., Tas N., de Boer M., Subramaniam V., Elwenspoek M., Mesa+ Institute for Nanotechnology, NL

1D nanochannels are fabricated by direct bonding between the silicon wafer containing the nanochannels, microchannels, access holes and the blank thin glass of 170 µm thickness. The thin glass wafers are used as channel covers [...]

Multi-walled Carbon Nanotube Film as Strain Sensors for Structural Vibration Control

Li X., Levy C., Florida International University, US

We have employed pure multi-walled carbon nanotube (MWCNT) films as strain sensors for structural vibration control. The MWCNT films were prepared by solution/filtration method and were bonded directly onto aluminum specimens by nonconductive adhesives. Conventional [...]

Multisensor Network for Distance Data Pick-up

Husak M., Jakovenko J., Vitek T., Czech Technical University in Prague, CZ

The core of the paper describes a multisensor system for measurement and distance data transfer. The realized system for measurement of air temperature, pressure and humidity is described as a example. Eight physical quantities can [...]

Design of Radiation Tolerant Readout System for an Integrated SRAM Based Neutron Detector

Malinowski P., Makowski D., Jablonski G., Napieralski A., Technical University of Lodz, PL

This paper presents a design of a radiation tolerant readout system for an SRAM-based neutron detector. The radiation tolerance has been achieved on the system level by applying Error Detection and Correction schemes. The constructed [...]

Micromechanical GaAs Thermal Convertor for Gas Sensors

Jakovenko J., Lalinsky T., Drzík M., Vanko G., Czech Technical University in Prague, Faculty of Electrical Engineering, CZ

This paper discusses design, simulation and fabrication of new Micromechanical Thermal Converters (MTCs) based on GaAs developed for Gas sensors. GaAs MTCs seem to be very attractive for design of thermally based MEMS sensor devices. [...]

Global MEMS Equipment and Materials Markets and Opportunities

Sheet L., SEMI, US

The global MEMS market is experiencing strong growth, driven by consumer applications, MEMS-CMOS integration, automotive applications and emerging MEMS device markets. MEMS manufacturing technology and materials are critical to the continued growth in this market. [...]

A study on the novel micromixer with chaotic flow

Lee S-H., Kang H.J., Choi B.K., Sogang University, KR

We design that a fluid was rotated by a coupling between Lorentz force and a moving force of a electric charge in an electric field. And it generate barrier embedded chaotic flow to use mass [...]

Bonding Pad with Reduced Capacity

Mats I., Tarcenco V., Select Techno-Fix Ltd, CA

The technical solutions for the Integrated Circuits (ICs) packaging remains enough conservative during microelectronics development. The ICs with active components having size of micrometers or even nanometers continue to have bonding pads area within hundreds [...]